The report also informed about the Snapdragon 1000 developer platform having two 128 GB UFS 2.1-rated memory modules and 16GB of LPDDR4X RAM on board. It's expected that the SDM1000 will share the 5G-capable cellular modem that will appear on the Snapdragon 855.
That's almost three times the power draw of Intel's Y-series processors and just 3W behind the chipmaker's U-series chips. It is imperative to observe higher capability of a processor in case of higher TDP.
WinFuture references a newly-developed power management chip to handle the increased needs of this chip and how it consumes energy, so that may be mitigated. ARM is expected the A76 to deliver a performance similar to U-series Intel Skylake processors. We're already aware of the upcoming Snapdragon 850, which looks like an overclocked Snapdragon 845. The Snapdragon 1000 is nowhere close to being as big as Intel's chips, but the latest development reveals that the USA -based chip manufacturer is coming close.More news: Mexico hold off South Korea to pile pressure on Germany
The new report also claims that the Snapdragon 1000 will be a socketed chipset.
The SDM1000, as it is internally named, is thought to release as the Qualcomm Snapdragon 1000, possibly in 2019. It suggests that the owner of the test device can swap out the chip. In other words, the SoC will not be soldered to the motherboard. However, rumors surrounding the SD1000 suggest the US -based chip maker could be venturing a new territory of manufacturing swappable processors.More news: Diego Maradona During Argentina v Nigeria Game